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Basics of in-line critical dimension metrology


This course provides attendees with a basic working knowledge of critical dimension metrology. The course starts with definitions of commonly used metrology terms, reviews current challenges and explains importance of metrology in achieving semiconductor manufacturing goals. All basic patterning metrology techniques are reviewed through the course. Their physical principles, merits and limitations are detailed. The material leads to the conclusion that only a combination of various metrology techniques may solve complex problems which semiconductor manufacturing is facing today. The final topic of the course is a reference dimensional metrology which cements various techniques in a single metrology solution. 

Learning outcomes 

This course will enable you to: 
  • Apply metrology terms correctly and with confidence 
  • Describe physical principles, merits and limitations of basic metrology techniques 
  • Identify the best technique for your specific metrology task 
  • Avoid common mistakes and misconceptions related to specific metrology technique 
  • Justify use of several techniques to build flexible and trustful metrology solution 

Intended audience 

This material is intended for anyone who wants to learn basics of critical dimension metrology for their everyday work. Those who either develop their own metrology solutions or who work with external or internal metrology providers will find this course valuable. 

Course level 


Course Length 

A half-day (3.5 hours) 


The instructor of this course is an expert in critical dimension and reference metrologies who was developing metrology solutions for six technology nodes at Texas Instruments. The instructor has more than 60 scientific publications in surface science, photochemistry, semiconductor characterization and dimensional metrology. 


The course is using some materials from Handbook of Silicon Semiconductor Metrology, editor A. C. Diebold, Marcel Dekker, Inc., New York • Basel, 2001.